Phase 11 半导体热阻分析仪

Phase 11 半导体热阻分析仪      

一、Analysis Tech Phase11 Phase10 概述

   半导体热分析仪Semiconductor Thermal Analyzer热阻测试仪,由美国Analysis Tech Inc公司的PHASE10 PHASE11 热阻测试仪电子封装器件,符合美军标和JEDEC标准. Analysis Tech Inc.成立于1983年,坐落于波士顿北部,是电子封装器件可靠性测试的国际设计,制造公司。他的创始人是John W.Sofia,美国麻省理工的博士,并且是提出焊点可靠性,热阻分析和热导率理论的专家. 发表了很多关于焊点可靠性,热阻分析和热导率论文. Analysis Tech Inc.在美国有独的实验室提供技术支持

  热阻分析仪Phase 11主要用于二极管、三极管、线性调压器、可控硅、LEDMOSFETMESFETIGBTIC等分立功率器件的热阻测试和分析。

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二、Analysis Tech Phase 11 Phase10 工作原理及测试过程

       Phase 11采用油浴法测定热敏参数校正曲线。在通以感应电流结还没有明显产生热量时,如果给定足够的时间,结温和壳温将达到热平衡,壳温非常接近结温。将热电偶直接连接到器件表面采集数据时,油浴将充分保证器件的温度稳定并且使热电偶采集的温度等于感应结温。

       在这个环节中,感应电流大小的选择是很重要的。感应电流过大,会导致结温明显变化;感应电流过小,会导致正向压降值测量误差较大。Phase 11 感应电流的可选范围是0.1mA~50mA,完全符合JEDEC标准。

       在加热器件的过程中,Phase 11 采用了脉冲加热方式,如下图所示:

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加热电流和感应电流通过电子开关切换的方式轮流工作。每加热15秒,测量1次热敏参数,即获得1个结温值,测量完之后继续加热,加热15秒,再次测量结温值,如此反复工作。在这个过程中,系统将每次测量到的结温值和前面7个结温值进行比较,如果连续8个结温值相同,系统会判定器件达到热平衡,并计算出稳态热阻值。

       如果用户需要得到热阻热容曲线,只需要将电子开关锁定在测量端即可。此时,因为没有了加热电流,器件开始降温,通过监测器件电压可以得到一条温度下降的曲线,进而通过一系列数学变换得到热阻热容曲线以及瞬态热阻抗曲线。

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三、Analysis Tech Phase 11  Phase10 技术指标

Ø     加热电流测量精度(低电流测量:0.2A,1A2A测量)

      2A系统:±1mA10A系统:±5mA 20A系统:±10mA

Ø     加热电流测量精度(高电流测量:2A,10A20A测量)

      2A系统:±4mA10A系统:±20mA 20A系统:±40mA

Ø     加热电压测量精度:±0.2%读数±0.025%量程

Ø     热电偶测量精度(T型):典型±0.1,最大±0.3

Ø     结温测量精度:典型±0.1

Ø     结温测量延迟时间:1us

Ø     设备工作电压:220VAC3A50/60Hz

Ø     器件的最大供电电压:5V(选配Power Booster可以扩展到100V

Ø     器件的最大供电电流:2A10A20A(选配Power Booster可以扩展到1000A

Ø     结温的感应电流:1mA5mA10mA20mA50mA0.1~50mA可设定

 

四、附件介绍

1Nuova校准浴锅

用来得到节电压和结温的函数关系即K值。

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产品特点:

1)由集成在热阻分析仪中的模块直接进行温度控制

2)使用有陶瓷镀层的磁力搅拌器

3)带有冷却风扇的坚固底盘能够控制升温速率并保证安全性

4)有盖的四升不锈钢水浴锅

5)悬挂结构支持部件被校准

6)四升绝缘良好的导热矿物油,对环境无害并能重复使用

 

2EVN-12静止空气测试箱

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EVN-12是用于在标准化的静止空气环境中测试元件。自然对流条件下的热阻测量会对实验室里的不期望的空气流动非常敏感。这套静止空气测试箱可以排除这种潜在的产生测试错误的因素。

 

3、风洞

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相对于静止空气测试箱,伺服控制风洞提供了一个强制对流、均匀一致的测试环境。在测试对气流比较敏感的器件时,我们能够更加准确地测量出器件在不同风速下的热阻。

 

4Rjc测试夹具(风冷型)

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风冷型Rjc测试夹具是一个高性能的风冷型热沉,可以很方便地固定被测器件,是测量JEDEC标准定义Rjc的理想夹具。Rjc测试夹具采用了一种特殊的装置可以准确的测量壳温。

 

5Rjc测试夹具(水冷型)

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水冷型Rjc测试夹具需要配合循环冷水机使用,具有散热迅速的特点,通常用来测试IGBTMOSFET等功率较大的器件。

 

6Rjb测试夹具

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完全按照JEDEC JESD51-8的要求设计,用来测试结到电路板的热阻。

 

7LED高压放大器

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当被测LED的正向压降高于5V,可以选择LED高压放大器,提供28V的测试电压。

 

8、功率放大器

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提供高达200A400A1000A的加热电流。

 

9、热阻分析仪校准仪

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溯源到NIST,可以用于热阻分析仪的故障诊断,建议每半年对热阻分析仪做一次校准。

 

10、热电偶校准仪

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溯源到NIST,用于对热电偶接口进行校准。

 

        

五、Analysis Tech Phase 11 主要特色

Ø     所有测试数据、图像全屏显示

Ø     高速数据采集和分析,能对各种类型器件进行测试

Ø     能够输出常规的数据和文件类型,能将设置参数和数据存储在硬盘上

Ø     能对操作人员的错误和测试数据的有效性进行连续监测

Ø     四线制测试方法排除测试导线电阻的影响

Ø     兼容IEEE488RS-232C通讯方式,测试方法遵循MIL&JEDEC标准

Ø     根据电流、功率或ΔTj对器件的功率进行自动控制,用户选择热平衡的监测方法

Ø     对附属设备进行自动控制,对集成电路和多芯片模块有多结探测能力

Ø     三个内部参考热电偶,能通过红外线对器件表面的温度进行测试

Ø     有标准和常规的测试夹具,设备校准方便


Analysis Tech Thermal Analyzers measure semiconductor junction temperatures using the electric method of junction temperature measurement for testing all types of semiconductor devices. This capability is the foundation of numerous test methods including: thermal resistance, transient thermal impedance, die attach screening and functional power cycling. The convenient flexibility of the analyzer also facilitates interconnected control of other laboratory test equipment. 

Semiconductor Thermal Analyzers perform thermal measurements on all types of packaged semiconductor devices including diodes, LEDs, bipolar transistors, MOSFETs, functional analog/digital integrated circuits, ACSICS, IGBTs, SCRs, TRIACs, and thermal-test-dies. All products offered conform to applicable JEDEC and MIL Standards.

Using the electrical method of junction temperature measurement, Analysis Tech Thermal Analyzers accurately measure component thermal parameters - essential for design and implementation of thermally reliable electronics. In addition to equipment sales, Analysis Tech offers 
Component Test Services for thermal characterization of semiconductor devices at our factory test-laboratory. 

This type of test equipment is alternately known as: semiconductor thermal resistance testers, semiconductor thermal impedance testers, component thermal resistance testers, component thermal impedance testers, die attach testers, die attachment testers.

 

The Analysis Tech Thermal Analyzer Phase 11 provides comprehensive automated control of semiconductor thermal measurements for production and development testing with powerful features such as:

All Test Modes:

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Test capabilities for all   device-types: diodes, LEDs, bipolars, MOSFETs, IGBTs, functional ICs,   thryistors, thermal test dies

Automated high speed data collection,   reduction, and analysis  

Compatible with all 750E Mil Stds and   JEDEC 51 Series methods 

Data plots for all test parameters in   all tests modes 

Simple, automated "in-lab"   instrument-calibration procedures  

Various text and graphics file formats   for convenient exporting

Continuous intelligent monitoring for   errors and data validity 

Kelvin (4-wire) connections to   eliminate test cable resistances effects 

Compatibility with USB, IEEE 488, and   RS-232C communications 

10/100 Ethernet NIC interface

Test methods compatible with MIL &   JEDEC test standards 

Selection of automatic power-control   by current, wattage, and ΔTj

Standard and custom test fixturing   available 

Windows XP Pro operating system

Steady State Thermal Resistance Mode:  

Multi-junction temperature sensing   capability for ICs & multi-die devices 

User-selectable thermal equilibrium   criteria

Batch-mode for determining power level   and air flow effects

Control of accessory laboratory   equipment for integrated testing

Infrared case temperature measurement   capability

Capability for automatically switching   the device under test

Die Attach or Power Pulse Mode: 

Pass/Fail or bin sorting based on die-attach quality

Serialized part testing

Data plots of all parameters   including die-attach histogram

Extended-life testing with   interspersed die-attach testing

Interface for mechanized device handlers

Batch mode die-attachment production   testing multi-chip modules

Heating Characterization / Transient Thermal Impedance Mode:

Heating and cooling curve   time-resolution: 1 microsecond

Heating and cooling curve span: 1   microsecond - 10,000 seconds

Heating and cooling curve   points-per-decade plotted: 15

Utilizes time-constant-spectrum and   structure function analyses

Optimized compact dynamic RC models   with 2-8 discrete stages

Multiple Sense-Junction Channels
  Up to eight junction temperatures can be simultaneously sensed for testing   devices with multiple junctions

 and for characterizing multi-chip packages   or modules. In multiple-die packages, the die-to-die heating

(thermal cross-coupling) must be   measured to accurately characterize these type of packages. For testing

functional integrated circuits (ICs),   multiple sense junctions offer validation of the junction temperature (Tj)

readings in instances where some of   the Tj sense connections are subject to the spurious electrical effects

of other portions of the IC circuitry.   When testing hybrids and large-die ICs, multiple sense junctions can

reveal temperature distributions that   occur when substantial temperature variations exist within the test device.

 Multiple sense channel applications include:

▪Multi-die     devices where multiple heat sources may exist▪Thermal     cross-coupling associated with multi-chip devices▪Larger     devices which may exhibit substantial temperature gradients during normal     powered operation

  Multiple sense channels also permit the calibration of up to 8 sense   junctions simultaneously for faster calibration through-put. 
  Batch Mode and Bin Sorting for Power   Pulse Testing
  Accurate and rapid screening of device thermal characteristics can   dramatically enhance production-device

reliability. Die Attachment testing provides an   excellent gauge of the chip attachment-quality in terms of the

device impedance. The Phase 11 Thermal Analyzer   provides programmable relay drivers for controlling

external devices during Power Pulse Testing. These   drivers offer the following capabilities:

▪switching     between test points in hybrid circuit test fixtures for multiple sequenced     tests▪manual or     automatic handler controls bin sorting based on die attachment test results

  The test switching capability of the Thermal Analyzer allows one test fixture   to carry all the test connections or

 test-point probes for a batch of tests   required for testing complex hybrids. Thus all significant die attachments

 on a hybrid can be tested with one insertion   and one test initiation.
  Bin sorting is utilized in die attach testing to rapidly sort devices based   on die-attachment quality. The bin

 sorting control can be used with manual   insertion testing or with automatic component transfer systems

which would insert devices to be tested   into test fixtures and subsequently eject the tested device into one

of up to eight bins. (see Die Attach Testing in Production Environments)   
  Accessory Equipment Control Ports
  Frequently, device thermal performance must be evaluated over a range of   external conditions. Such conditions

might include cooling air flow,   ambient operating temperature, coolant flow rate, or the heating supply   voltage.

The Thermal analyzer can control   accessory test equipment via USB, IEEE, or serial communication to

achieve integrated batch testing under   a wide range of external conditions. The Analysis Tech accessory

Batch Switching Module provides a   convenient means to switch the device-under-test so that many devices

 can be tested sequentially in batch mode.
  The simple setup and control procedures of the Thermal Analyzers allow the   test engineer to initiate up to

200 tests in batch mode. Tests are   successively executed automatically: as a test reaches completion,

the external condition is incremented   and the test cycle repeated until the batch of tests is completed.

Once these batch tests have begun,   data reporting and accessory equipment control are automatically

coordinated.

The Analysis Tech Phase 11 Thermal   Analyzer performs a   variety of semiconductor thermal tests controlled

 from a powerful   Windows based operating program and continuous-display front panel meters.

The convenient user-interface facilitates complete thermal   characterization for any type of semiconductor

 device or package   type according to Mil Std 750E and JEDEC 51 Series methods..
  The Phase 11 Thermal Analyzer can be easily   configured to perform tests on a wide range of device types

including digital or analog functional integrated circuits,   thermal test dice, bipolar transistors, diodes,

MOSFETS, IGBTS, thyristors, and ASICs. During testing,   comprehensive graphic data-displays offer

 superb detail on all   test data, thus promoting confidence and understanding of the test results.

All semiconductor junction temperatures are accurately   measured using the electrical method.
  Parts can be tested by simply selecting the   part-specific Setup File which includes all of the necessary

 test parameters for   the desired test method. Test data is stored on the PC hard disk including   final

numerical data such as thermal resistance, power levels,   reference temperatures, as well as data plots,

 and pass/fail   evaluations. Text and graphic files can be stored in various file formats as   needed for

export to other Windows applications. A network connection   (NIC) is provided so that test data can

be archived to your LAN.
  The Analysis Tech Phase 11 Thermal Analyzer   provides manual or automatic heating power control.

Three thermocouples reference temperatures ports are   provided for measurement of external package

 temperatures such   case, lead, etc. Thermal equilibrium is automatically detected based on a   variety

 of user-selectable   criteria. Real-time data plots and tabular displays are readily accessible as   testing

proceeds. Batch Mode testing offers automatic sequencing of   tests with alternate power levels,

different test-devices, or varied environmental conditions   such as ambient air flow speed or temperature.
  The Phase 10/11 Calibrator offers a powerful and convenient method for annual or   biannual instrument

calibration without the expense and "down-time"   associated with typical "cal-lab" procedures. Thermocouple

 calibration is   comprehensive and automated with the Phase 10/11 Tc Calibrator. 
  Die attachment bin-sorting offers an efficient   means to sort devices according to the thermal quality of the

die attachment. Power Pulse Batch Mode performs a rapid   sequence of die-attachment tests on up to

 eight separate   devices. With this capability, multiple active devices on a multi-chip module   can be tested

 for die-attachment   with one insertion of the device-under-test.
  The Analysis Tech Phase 11 Thermal Analyzer   uses an external DC supply for the heating power source,

coupled to the Thermal Analyzer via a rear-panel   connection. In all test modes, the external supply is

controlled by the Thermal Analyzer to provide the desired   heating-power level. The external power supply

 is not included with   the Thermal Analyzer but can be purchased as part of the Discount Accessory

 Package or   separately.
  The maximum power handling capacity of the   Analysis Tech Phase 11 Thermal Analyzer is 100W, 500W,

 and 1000W for the   2A, 10A, and 20 A analyzers, respectively. The Power Booster accessory offers heating

 currents up to 1000   amps and heating power levels up to 6000 watts. 
 
  All Thermal Analyzer sales include free   training at our factory-based test lab facilities.